AcquisitionsMay 3, 2026, 08:01 PM
Applied Materials Acquires ASMPT's NEXX Business
AI Summary
Applied Materials, Inc. announced a definitive agreement to acquire ASMPT Limited's NEXX business, a leading supplier of large-area advanced packaging deposition equipment. This acquisition will expand Applied's portfolio of panel-level advanced packaging technologies, crucial for building larger-body AI accelerators and improving energy efficiency. The move supports the industry's shift from 300-millimeter silicon wafers to larger panel form factors, enabling more complex 2.5D and 3D chiplet stacking. The transaction is expected to close within the next several months and does not require regulatory approvals.
Key Highlights
- Applied Materials to acquire ASMPT's NEXX business, a supplier of large-area advanced packaging deposition equipment.
- Acquisition broadens Applied's portfolio of panel-level advanced packaging technologies.
- Aims to enable larger-body AI accelerators for higher energy-efficient performance.
- Addresses the industry transition from 300mm wafers to larger panel form factors (up to 510x515mm).
- Adds NEXX's panel-level electrochemical deposition (ECD) technology to Applied's offerings.
- Transaction expected to close within several months, subject to customary closing conditions.
- No regulatory approvals are required for the transaction.
- NEXX team will join Applied's Semiconductor Products Group and remain based in Billerica, Massachusetts.