New LaunchJun 15, 2026, 04:06 PM
Applied Materials Launches New Chipmaking Systems for 3D Structures
AI Summary
Applied Materials introduced two new chipmaking systems, Centris Spectral SiN ALD and Producer Selectra Mo Etch, designed for precision processing in deep and narrow 3D logic and memory chip structures. These systems enable uniform material deposition and selective metal removal, helping chipmakers extend scaling for higher performance, improved energy efficiency, and better manufacturing yield in next-generation AI chips. The new systems are already being adopted by leading logic and memory chipmakers.
Key Highlights
- Applied Materials launched Centris Spectral SiN ALD and Producer Selectra Mo Etch systems.
- Centris Spectral SiN ALD enables uniform silicon nitride deposition in high-aspect-ratio 3D structures.
- Producer Selectra Mo Etch selectively removes molybdenum for wordline separation in 3D NAND.
- The new systems help chipmakers extend scaling in logic and memory for next-generation AI chips.
- They deliver higher performance, improved energy efficiency, and better manufacturing yield.
- The new systems are already being used by leading logic and memory chipmakers.
- Centris Spectral SiN ALD is the latest system based on Applied's new Spectral ALD platform.
- Producer Selectra Mo Etch expands the Selectra portfolio into advanced metal integration.
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