Business UpdateJul 10, 2026, 07:56 AM
BTQ & ICTK Complete Design of Next-Gen QCIM Security Chip
AI Summary
BTQ Technologies Corp. announced the completion of the design for its next-generation QCIM + PUF security chip, developed in collaboration with ICTK Co., Ltd. The chip integrates BTQ's Quantum Compute-in-Memory (QCIM) security intellectual property with ICTK's VIA PUF™ technology to provide hardware-rooted authentication, cryptographic acceleration, and trusted device identity. This development targets applications in IoT, AI devices, industrial systems, and connected infrastructure, with production preparation now underway and test chips expected to ship by year-end 2026.
Key Highlights
- BTQ & ICTK completed design of next-generation QCIM + PUF security chip.
- Chip combines BTQ's QCIM security IP with ICTK's VIA PUF™ technology.
- Designed for hardware-rooted authentication, cryptographic acceleration, and trusted device identity.
- Targets IoT, AI devices, industrial systems, secure elements, and connected infrastructure.
- Production preparation is now underway for the new chip.
- Test chips expected to ship to key customers and strategic partners by year-end 2026.
- Builds on May 2025 MoU and October 2025 US$15 million joint development agreement.
Price Impact
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