New LaunchJun 8, 2026, 08:16 AM
MACOM Unveils Hot Via Process & MASW-011261 SP2T Switch
AI Summary
MACOM Technology Solutions Inc. announced a new chip scale hot via process built on its AlGaAs diode technology. This innovation simplifies surface mount assembly, reduces complexity, and improves high-frequency performance by routing RF signal and ground paths vertically through the die. The first product utilizing this process is the MASW-011261, a broadband SP2T switch operating from 60 to 110 GHz, which will be showcased at the International Microwave Symposium (IMS 2026).
Key Highlights
- MACOM launched a new chip scale hot via process for AlGaAs diode technology.
- The process simplifies surface mount assembly and improves high-frequency performance.
- The first product using this technology is the MASW-011261 broadband SP2T switch.
- MASW-011261 operates from 60 to 110 GHz.
- It delivers typical insertion loss of 0.9 dB and 30 dB isolation.
- Features sub-20 ns switching speeds in a compact 1.87 mm x 1.98 mm package.
- The new process and product will be displayed at IMS 2026.
Price Impact
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