New LaunchApr 30, 2026, 05:41 AM
SHMD Launches Any Layer ET Process for Advanced Packaging
AI Summary
SCHMID Group introduced its proprietary Any Layer ET (Embedded Trace) Process, a full panel-level damascene platform for next-generation build-up layer manufacturing in advanced packaging. This technology enables ultra-fine line structures, superior signal integrity, and enhanced power delivery for complex substrates, supporting AI and high-performance computing. SCHMID develops and licenses the process while supplying critical production equipment, positioning itself as a key enabler for industrializing advanced packaging.
Key Highlights
- SCHMID Group launched its proprietary Any Layer ET Process for full panel-level Advanced Packaging.
- The process enables precise copper embedding within dielectric layers for ultra-fine line structures.
- It delivers superior signal integrity, enhanced power delivery, and excellent surface planarity.
- The technology is suited for advanced IC substrates, panel-level packaging, and glass core substrates.
- The platform is built around SCHMID's InfinityLine C+, PlasmaLine, InfinityLine P+, and InfinityLine L+ equipment.
- It offers full panel-level scalability for cost-efficient high-volume manufacturing.
- Chief Sales Officer Roland Rettenmeier will present on the technology at ECTC 2026 in May.
Price Impact
More from SHMD