Management ChangeMay 6, 2026, 09:17 AM
Fabric.AI Appoints Bill Maffucci to Lead Neural I/o Chip Program
AI Summary
Fabric.AI announced the appointment of Bill Maffucci as Head of Development for its jointly developed Neural I/o™ chip program with Kopin. This MicroLED-based optical interconnect is considered a cornerstone technology for next-generation AI factory infrastructure, designed to enable ultra-high-bandwidth communication between advanced AI systems. The company believes MicroLED optical interconnects represent a significant market shift, with the data center optical interconnect market projected to reach tens of billions of dollars annually, and has already signed NDAs with two major chipmakers.
Key Highlights
- Fabric.AI appointed Bill Maffucci as Head of Development for the Neural I/o™ chip program.
- Maffucci will lead end-to-end development of the Fabric.AI / Kopin Neural I/o chip.
- The Neural I/o™ chip is a MicroLED-based optical interconnect for next-generation AI factory infrastructure.
- Fabric.AI has signed NDAs with two major chipmakers for the Neural I/o roadmap.
- The data center optical interconnect market is projected to reach tens of billions of dollars annually.
- MicroLED interconnects aim to offer lower power, higher channel density, lower cost, and improved reliability.
- Maffucci previously served as Senior Vice President of Product Development & Strategy at Kopin Corporation.
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