Monthly UpdateApr 26, 2026, 05:23 AM
TSM Issues NT$17.2B Bonds; Acquires NT$23.2B Fixed-Income Assets
AI Summary
Taiwan Semiconductor Manufacturing Company Limited (TSMC) reported its monthly updates for March 2026, including the issuance of unsecured bonds totaling NT$17.2 billion across two tranches. The company also acquired NT$23.2 billion in fixed-income investments. Additionally, several board directors and executive officers, including Chairman & CEO C.C. Wei, increased their shareholdings during the month.
Key Highlights
- TSMC issued NT$12.6 billion in unsecured bonds (Tranche A) with a 1.72% coupon rate, maturing March 2031.
- TSMC issued NT$4.6 billion in unsecured bonds (Tranche B) with a 1.78% coupon rate, maturing March 2036.
- Acquired NT$23.2 billion in fixed-income investments.
- Chairman & CEO C.C. Wei increased shareholdings by 235,340 shares to 8,152,610.
- Executive Vice President Y.P. Chyn increased shareholdings by 64,409 shares to 9,362,042.
- Senior Vice President and CFO Wendell Huang increased shareholdings by 40,874 shares to 1,811,543.