IZMO Ltd's Subsidiary, izmomicro, Expands Defence Electronics Supply Business in Advanced Semiconductor Packaging
izmomicro, the advanced semiconductor packaging subsidiary of NSE/BSE-listed izmo Limited, announced the ongoing supply of advanced semiconductor packaging solutions to India’s defence electronics sector. The company is currently supplying advanced packaging technologies for defence electronics programs in two specialized areas: high-frequency RF module packaging, and radar receiver module assembly and packaging. These solutions are supplied for demanding defence applications where signal integrity, thermal performance, electromagnetic compatibility, and long-term reliability are essential across airborne, shipborne, and ground-based systems. izmomicro is also engaged in the ongoing assembly, packaging, and supply of radar receiver module subsystems used in sophisticated radar signal chains. The global defence electronics market is valued at more than US$130 billion and continues to grow as nations invest in next-generation radar, communications, sensing, and electronic warfare systems. In India, rising defence modernization and domestic development programs are increasing demand for indigenous suppliers with advanced electronics packaging and subsystem integration capabilities.
Key Highlights
- izmomicro supplies advanced packaging solutions for RF integrated circuits and front-end module assemblies operating at microwave and millimeter-wave frequencies
- The company is engaged in the ongoing assembly, packaging, and supply of radar receiver module subsystems used in sophisticated radar signal chains
- izmomicro's work includes precision QFN (Quad Flat No-Lead) packaging for high-frequency devices, custom hermetic and semi-hermetic enclosures for RF module assemblies, and multi-chip integration of RF, analogue, and digital components within compact package designs
- The global defence electronics market is valued at more than US$130 billion and continues to grow
- In India, rising defence modernization and domestic development programs are increasing demand for indigenous suppliers with advanced electronics packaging and subsystem integration capabilities
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