ExpansionAug 7, 2026, 05:05 AM
ACM Research Expands Ultra C Tahoe Platform for Advanced Wet Processing
AI Summary
ACM Research, Inc. announced the expansion of its Ultra C Tahoe system into a multi-process wet processing platform, now supporting a broader range of advanced wet processing applications for logic and memory device manufacturing. The expanded platform, leveraging ACM's proprietary hybrid wet processing technology, has been adopted by multiple leading semiconductor manufacturers. Key enhancements include new etching capabilities, more efficient monitor wafer reclaim, and significant reductions in sulfuric acid consumption, contributing to improved productivity and sustainability.
Key Highlights
- Expanded Ultra C Tahoe system into a multi-process wet processing platform.
- Supports broader advanced wet processing applications for logic and memory device manufacturing.
- Platform adopted by multiple leading semiconductor manufacturers, demonstrating production readiness.
- Integrates batch and single wafer processes using proprietary hybrid wet processing technology.
- New capabilities include uniform silicon nitride recess etching and tungsten recess processing.
- Added Recycle monitor wafer reclaim processing, now in volume production at customer facilities.
- Achieved average particle count of fewer than 6 particles at 26 nm.
- Can reduce sulfuric acid consumption by up to 75% for environmental and cost benefits.
Price Impact
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