Business UpdateAug 7, 2026, 05:05 AM
ACM Research Receives Orders for Ultra ECP ap-p Tool
AI Summary
ACM Research, Inc. announced it has received orders for its proprietary Ultra ECP ap-p horizontal panel-level electroplating tool from two advanced packaging customers. These orders include a production order for a 510 × 515 mm tool from an existing mainland China customer, scheduled for delivery in H1 2027, and an evaluation order for a 310 × 310 mm tool from a new Asian panel-manufacturer, with delivery in Q4 2026. These orders expand the market reach of the Ultra ECP ap-p, grow ACM's global customer base, and reinforce its position in the advanced packaging equipment market.
Key Highlights
- Received production order for one 510 × 515 mm Ultra ECP ap-p tool.
- Order from an existing advanced packaging customer in mainland China.
- Delivery for the production order is scheduled for the first half of 2027.
- Received evaluation order for one 310 × 310 mm Ultra ECP ap-p tool.
- Evaluation order from a new leading panel-manufacturer customer in Asia.
- Delivery for the evaluation order is scheduled for the fourth quarter of 2026.
- Ultra ECP ap-p is the world’s first commercial horizontal panel-level copper deposition system.
- Tool supports various panel formats and plating processes including Cu, Ni, SnAg, and Au.
Price Impact
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