New LaunchJun 23, 2026, 08:50 AM
GlobalFoundries SLATE 3D Integration for 5G RF-SOI Ready
AI Summary
GlobalFoundries announced the production readiness of its SLATE wafer-to-wafer bonding technology on its 9SW radio-frequency silicon-on-insulator (RF-SOI) platform. This advanced 3D integration solution, manufactured in Singapore, enables more compact and power-efficient cellular front-ends for 5G devices by reducing die size by up to 45% and improving efficiency by over 20%. Volume production is expected by the second half of 2027.
Key Highlights
- SLATE wafer-to-wafer bonding technology is production-ready on 9SW RF-SOI platform.
- Enables advanced 3D integration for compact, high-performance cellular front-ends.
- Manufactured at GF’s 300mm facility in Singapore.
- Expected to ramp to volume production by the second half of 2027.
- Can reduce overall die size by up to 45% for space-constrained applications.
- Delivers over 20% enhancement in efficiency through lower Ron*Coff.
- Supports next-generation 5G mobile devices and satellite communications.
Price Impact
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