Loan & DebtJun 3, 2026, 06:07 AM
United Microelectronics to Issue NT$16B in Convertible Bonds
AI Summary
United Microelectronics Corporation's Board of Directors resolved to issue two tranches of unsecured convertible bonds, totaling up to NT$16 billion. The first bond is for up to NT$12 billion and the second for up to NT$4 billion, both with a 0% coupon rate and a five-year issuance period. The capital raised will be utilized for the purchase of machinery and equipment, supporting the company's operational expansion.
Key Highlights
- Board of Directors resolved to issue two tr0anches of unsecured convertible bonds.
- The 1st Unsecured Convertible Bond is for up to NT$12 billion in par value.
- The 2nd Unsecured Convertible Bond is for up to NT$4 billion in par value.
- Total capital to be raised is up to NT$16 billion.
- Funds from both issuances will be used for the purchase of machinery and equipment.
- Both convertible bonds have a temporarily set 0% coupon rate.
- Both convertible bonds have a temporarily set five-year issuance period.
Price Impact
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