HUHUTECH International Group Inc.

HUHUTECH International Group Inc. announced a JPY 83 million (approximately US$580,000) contract through its Japanese subsidiary for vacuum exhaust pipeline insulation systems at a leading international semiconductor manufacturer's facility in East Hiroshima, Japan. This project marks the initial commercial application of HUHUTECH's nano-aerogel insulation technology, developed over approximately one year of R&D. The contract expands the company's product portfolio for semiconductor facility infrastructure and reinforces its strategy of developing higher-value-added products and integrated technical solutions, strengthening its presence in Western Japan's semiconductor manufacturing region.

HUHUTECH International Group Inc. announced that its subsidiary, Jiangsu HUHU Electromechanical Technology Co., Ltd., has completed the independent development of the HB-800, a high-end vacuum furnace. This milestone signifies HUHUTECH's strategic evolution from a facility engineering firm to an integrated solutions provider with proprietary equipment, broadening its role with semiconductor and advanced-manufacturing customers. The HB-800 is ready for commercial deployment, targeting five key end-markets, and is expected to deliver significant operational efficiencies for customers. The company anticipates signing its first equipment order in Q3 2026, with the new business line projected to yield attractive margins.

HUHUTECH International Group Inc. announced that its German subsidiary, HUHU Technologies Deutschland GmbH, secured seven purchase orders totaling approximately €13.9 million (US$15.0 million). The contract is with a leading European advanced-node semiconductor wafer fabrication operator for high-purity process systems. Approximately 20% of the contract value is expected to be recognized in fiscal year 2026, with the remainder in fiscal year 2027.

HUHUTECH International Group Inc. announced that its U.S. subsidiary, Aspirational Technology Co. (HUHU USA), secured an additional US$936,000 contract from a major U.S. semiconductor foundry. This follow-on engagement, related to the same Arizona facility as a previous US$3.0 million contract, will support new production capacity. The deal, signed in May 2026, is expected to be completed within the current fiscal year and reinforces HUHUTECH's presence in the U.S. semiconductor market as part of its "Global 2026" strategic initiative.

HUHUTECH International Group Inc. announced its German subsidiary secured a €13.9 million (approximately US$15.0 million) contract to supply High-Purity Process (HPS) system engineering projects to a leading European advanced-node semiconductor foundry. These orders, obtained through a competitive tender between October 2025 and May 2026, represent HUHUTECH's first strategic benchmark orders in Europe and support the customer's new wafer fab in Dresden. This milestone expands the company's "Global 2026" initiative, establishing its presence across all four core international markets.

HUHUTECH International Group Inc. provided a corporate update detailing its transformative achievements and strategic roadmap for 2026. The company reported significant operational progress in 2025, with Japan remaining its largest market and completing 199 projects, a 146% increase from the previous year. HUHUTECH also secured a $3.0 million order in the U.S. market and established operational hubs in Germany and Singapore. Additionally, the company launched a new corporate website and appointed Strategic Investor Relations LLC to enhance its investor outreach and capital markets positioning.

HUHUTECH International Group Inc. announced it received aggregate gross proceeds of US$3,000,000 from a recent offering. The company plans to utilize the net proceeds for working capital and general corporate purposes. This offering was conducted under a Securities Purchase Agreement and involved Pre-Funded Warrants.