STMicroelectronics N.V.

STMicroelectronics announced the timing for its second quarter 2026 earnings release and conference call. The company will release its Q2 2026 earnings before the opening of European Stock Exchanges on July 23, 2026. A conference call to discuss the financial results and business outlook will be held on the same day at 9:30 a.m. CET, with a live webcast available on the company's investor relations website.

STMicroelectronics has introduced the ST54M, a new secure chip designed for next-generation mobile devices. This innovative solution is the first in the world to integrate a hardware accelerator for post-quantum cryptography (PQC), alongside NFC, secure element, and eSIM functionalities. The ST54M aims to help manufacturers meet future security requirements for mobile transactions, digital identity, and connected services, with certifications expected by July 2026.

STMicroelectronics has introduced the ST54M, a new secure mobile chip featuring the world's first post-quantum cryptography (PQC) hardware accelerator. This single-die solution integrates NFC, secure element, and eSIM functionality to help smartphone and personal electronics manufacturers prepare for future security requirements. The chip supports a wide range of secure mobile applications, with certifications and production targeted for July 2026.

STMicroelectronics announced the launch of the VL53L9, a new 3D direct Time-of-Flight (dToF) LiDAR module. This compact module offers high-resolution spatial perception with 2,268 zones, a wide field of view, and a detection range from 5 cm to 9 meters at 100 frames per second. It is designed for edge-AI systems in various applications including robotics, industrial automation, smart buildings, AR/VR, and healthcare. Mass production is set to begin in early July 2026.

STMicroelectronics announced the launch of its new VL53L9, a compact direct Time-of-Flight (dToF) 3D LiDAR all-in-one module. This module offers industry-leading resolution of 2.3K zones, a wide field of view, and a sensing range from 5 cm to 9 meters, with up to 100 frames per second. Designed for diverse applications including robotics, industrial automation, and AR/VR, the VL53L9 simplifies integration with its compact form factor and AI-ready output data. Mass production and volume shipments are slated for early July 2026.

STMicroelectronics N.V. announced the pricing of a US$1.5 billion dual-tranche offering of senior unsecured bonds convertible into new or existing ordinary shares. The offering consists of two US$750 million tranches, maturing in 5 and 7 years, with interest rates of 0% and 0.625% respectively. The net proceeds will be used for general corporate purposes, including the early redemption of US$750 million Zero Coupon Convertible Bonds due 2027.

STMicroelectronics N.V. announced the pricing of a US$1.5 billion offering of senior unsecured convertible bonds, issued in two tranches of US$750 million each, maturing in 2031 and 2033. The 2031 bonds are zero-coupon with a 55% conversion premium, while the 2033 bonds carry a 0.625% annual interest rate and a 57.5% conversion premium. The net proceeds will be used for general corporate purposes, including the early redemption of US$750 million convertible bonds due 2027.

STMicroelectronics N.V. announced a US$1.5 billion dual-tranche offering of new senior unsecured convertible bonds. These bonds will have maturities of 5 years (2031) and 7 years (2033), with interest rates ranging from 0.00% to 1.125% and conversion premiums between 47.5% and 55%. The company will use the proceeds for general corporate purposes, including the early redemption of its outstanding US$750 million Zero Coupon Convertible Bonds due 2027, which will occur on July 16, 2026.

STMicroelectronics introduced the IIS3DWB10IS, an intelligent vibration sensor with in-sensor AI (ISPU 2.0) for industrial condition monitoring. This MEMS-based sensor offers wide bandwidth, high dynamic range, and energy efficiency, providing a compelling alternative to traditional piezosensors. It aims to improve equipment uptime, reduce unplanned downtime, and support predictive maintenance in harsh industrial environments. The global market for this technology is projected to exceed $5 billion by 2032.

STMicroelectronics has raised its revenue ambition for Data Centers, now expecting approximately $1 billion in 2026, a significant increase from the previously anticipated "nicely above $500 million." The company also projects that Data Center revenues could double in 2027, driven by continued strong demand for AI infrastructure and recent progress in capacity ramp-up.