Highness Microelectronics Showcases Capabilities at SEMICON India 2026
Highness Microelectronics Ltd. participated as an exhibitor at SEMICON India 2026, held from September 17-19, 2026, in New Delhi. The company, represented by Managing Director Mr. Gaurav Kejriwal, showcased its advancements from being a display manufacturer to a full-scale producer. Key highlights included their investment in clean-room technology and local engineering talent, enabling reduced reliance on imported components. The company demonstrated capabilities in glass cutting, Chip on Glass bonding, and Film-on-Glass (FoG) bonding, catering to niche sectors like defense, aerospace, medical, and industrial automation. This participation underscores their 'Make in India' initiative and strategic shift towards greater in-house manufacturing and localization, with plans for an expanded facility in Goa.
Key Highlights
- Participated in SEMICON India 2026, showcasing advanced display manufacturing capabilities.
- Demonstrated in-house capabilities in glass cutting and various bonding techniques.
- Highlighting transition from assembly to full-scale manufacturing with 'Make in India' focus.
- Expanding into defense, aerospace, and medical sectors with specialized display solutions.
- Future expansion planned with a new integrated facility in Goa.
Price Impact
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