Mold-Tek Packaging Board to Consider Bonus Shares, Dividend

Mold-Tek Packaging Ltd has announced a board meeting scheduled for August 26, 2026. The primary agenda items include the consideration and approval of issuing bonus equity shares to existing shareholders. Additionally, the board will discuss increasing the company's authorized share capital, subject to shareholder approval. They will also consider recommending a final dividend for the financial year ended March 31, 2026, and fix the details for the 29th Annual General Meeting, including the record date for dividend payment and e-voting.