StockWatch
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Packaging
Board Meeting15 Apr 2026, 11:01 pm

Mold-Tek Packaging Board to Consider First Interim Dividend on Apr 20, 2026

AI Summary

Mold-Tek Packaging Ltd has scheduled a Board of Directors meeting for Monday, April 20, 2026. The main agenda for this meeting is to consider and potentially approve the declaration of the First Interim Dividend for the Financial Year 2025-26. The company has also fixed Friday, April 24, 2026, as the record date for determining the eligibility of shareholders for this interim dividend, if declared. Furthermore, the trading window for the company's shares has been closed effective April 1, 2026, and will reopen 48 hours after the audited financial results for the quarter and year ended March 31, 2026, are declared.

Key Highlights

  • Board meeting on April 20, 2026, to consider interim dividend.
  • Record date for dividend eligibility set for April 24, 2026.
  • Trading window closed from April 1, 2026.
  • Closure is until 48 hours post Q4/FY26 results.