
Board Meeting15 Apr 2026, 11:01 pm
Mold-Tek Packaging Board to consider interim dividend on April 20, 2026
AI Summary
The Board of Directors of Mold-Tek Packaging Ltd is scheduled to meet on Monday, April 20, 2026, to consider the declaration of the First Interim Dividend for the Financial Year 2025-26. The record date for determining the eligibility of members for this potential interim dividend has been fixed as Friday, April 24, 2026. The company also confirmed that its trading window remains closed from April 1, 2026, until 48 hours after the declaration of audited financial results for the quarter and year ended March 31, 2026.
Key Highlights
- Board meeting on April 20, 2026, to consider interim dividend.
- Record date for interim dividend fixed as April 24, 2026.
- Trading window closed from April 1, 2026, until Q4 FY26 results.
Price Impact
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