Mold-Tek Packaging Sets Oct 9 Record Date for 1:1 Bonus Issue

Mold-Tek Packaging Ltd has announced October 9, 2026, as the record date to determine eligibility for its upcoming bonus issue. The company will issue one bonus equity share for every one fully paid-up equity share held, at a face value of ₹5 each. This bonus issue, approved by shareholders and the Board of Directors on September 28, 2026, will be funded by capitalizing reserves. The bonus shares will rank pari-passu with existing shares and are expected to be allotted by October 12, 2026. This corporate action aims to increase the company's paid-up capital.