Mold-Tek Technologies Announces 1:1 Bonus Share Issue

Mold-Tek Technologies Limited announced a proposal for a 1:1 bonus equity share issuance, meaning one bonus share for every existing share held. This proposal, made during the company's 25th anniversary, is subject to shareholder approval at the AGM on September 21, 2026, and other regulatory approvals. The bonus issue will increase the paid-up equity share capital from ₹5,76,10,236 to ₹11,52,20,472. The company stated that this issuance will not impact its solvency margin or other financial parameters. The Chairman & Managing Director highlighted this as a gesture of appreciation for shareholders' trust and confidence.