Mold-Tek Technologies Sets Oct 9 Record Date for 1:1 Bonus Share Issue

Mold-Tek Technologies Ltd has announced October 09, 2026, as the record date to determine eligibility for its upcoming bonus share issue. The company plans to issue one bonus equity share for every one fully paid-up equity share held, at a face value of Rs. 2 each. This corporate action aims to increase the company's paid-up capital by capitalizing reserves. The bonus shares will rank pari-passu with existing equity shares and are expected to be allotted by October 12, 2026. This move is intended to reward shareholders and potentially increase the liquidity of the company's stock.