StockWatch
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Telecom - Infrastructure
Board Meeting21 Jul 2026, 01:26 pm

Bondada Engineering Board Meeting on July 24, 2026

AI Summary

Bondada Engineering Ltd has announced a Board of Directors meeting scheduled for July 24, 2026. The agenda includes approving the Director's Report, Cost Auditor's Report for FY26, and recommending final dividend for FY26. The company will also discuss appointing auditors for FY27, authorize borrowing powers up to ₹500 crore via NCDs, and consider migrating its listing from BSE SME to BSE Main Board and NSE. The trading window for designated persons is closed from July 1, 2026, until 48 hours after the board meeting outcome.

Key Highlights

  • Board meeting scheduled for July 24, 2026.
  • Agenda includes dividend recommendation and auditor appointments.
  • Plan to migrate listing from BSE SME to Main Board and NSE.
  • Authorization to raise funds up to ₹500 crore via NCDs.
  • Trading window closed for designated persons from July 1, 2026.