Mold-Tek Packaging Proposes 1:1 Bonus Share Issue

Mold-Tek Packaging Limited's Board of Directors has recommended a bonus issue of equity shares in a 1:1 ratio, meaning one new equity share for every existing fully paid-up equity share held. This proposal, subject to shareholder approval, aims to reward shareholders, enhance share liquidity, and broaden retail investor participation. The company's paid-up equity share capital is expected to increase from ₹16.61 crore to ₹33.23 crore post-bonus issue. The Chairman & Managing Director also announced the proposed appointment of his son, Mr. Janumahanti Rana Pratap, as Director - Marketing and Strategy, highlighting a focus on leadership transition and future growth.