Sterlite Technologies Opens Qualified Institution Placement Issue

Sterlite Technologies Ltd has announced the opening of its Qualified Institution Placement (QIP) issue on June 24, 2026. The decision was approved by the Board of Directors on April 29, 2026, and subsequently by shareholders via postal ballot on June 16, 2026. The preliminary placement document, dated June 24, 2026, has been adopted, and the floor price for the issue is set at ₹613.69 per equity share, calculated as per SEBI ICDR Regulations. The company may offer a discount of up to 5% on the floor price. The issue price will be determined in consultation with the book running lead managers. The trading window for designated persons has been closed since May 14, 2026.