Paras Defence Subsidiary Signs MoU for ₹6,200 Cr OSAT Facility

Paras Semiconductors Private Limited, a subsidiary of Paras Defence and Space Technologies Limited, has signed a Memorandum of Understanding (MoU) with the MP State Electronics Development Corporation (MPSeDC). This collaboration aims to establish a greenfield advanced IC packaging OSAT facility in Madhya Pradesh. Paras Semiconductors plans to invest approximately ₹6,200 Crores in Indore-Ujjain for this facility, which will focus on advanced packaging operations including 3D heterogeneous integration, chiplet integration, and wafer bumping. The initiative signifies a significant expansion into the semiconductor manufacturing ecosystem.