StockWatch
·
Other Electrical Equipment
MoU29 Jul 2026, 06:50 pm

SPEL Semiconductor Signs MoU for Chip Design Collaboration

AI Summary

SPEL Semiconductor Ltd has announced a strategic tripartite Memorandum of Understanding (MoU) with California Software Company Limited (Calsoft) and Natronix India Private Limited. This collaboration focuses on research, development, design, and intellectual property creation in semiconductor chips, artificial intelligence, and related advanced technology solutions. SPEL will handle Assembly, Test, Mark, and Package operations, while Natronix-India will be responsible for Semiconductor IC design and Design IP. The company's Head Operations & Whole-Time Director has been authorized to finalize and execute the MoU.

Key Highlights

  • SPEL Semiconductor enters strategic MoU for chip design and AI.
  • Collaboration with Calsoft and Natronix-India for R&D and IP.
  • SPEL to focus on Assembly, Test, Mark, and Package operations.
  • Natronix-India to lead Semiconductor IC design and Design IP.